Layer volume;1 – 28
Used materials;FR-2, FR-4, CEM-1, FR-4 High TG, PI, PTFE, PPO, Rogers, Taconic, etc.
Width of conductor;min 0.1mm
Track pitch;min 0.1mm
Interelement spacing of printed-circuit wiring;min 0.2mm
Diameter of the via;min 0.1mm
Standard thickness of copper foil;18um, 35um, 70um
Coating;HASL, immersion gold plating, gold plating, immersion stannum, laminas’ gold plating
Solder mask;Liquid photoimageable solder mask of any colors (green, blue, red, yellow, black, etc.)
Printed circuit board processing by contour;milling, scribing, matched metal mold
Possible FR4 material thickness, mm;0.3 / 0.5 / 0.8 / 1.0 / 1.5 / 1.6 / 2.0
Maximum size of half-finished product;600 x 600 mm